Day Archives: November 1, 2025

Slated to be fully operational by 2027–28, the integrated facility is projected to have a processing capacity of 60,000 SiC wafers annually and handle the packaging of about 9.6 crore units.
Odisha

Odisha joins India’s semiconductor journey! Groundbreaking ceremony of SiCSem’s end-to-end chip production project

SiCSem, a power electronics chip company, performed the groundbreaking ceremony in Bhubaneswar on Saturday for setting up India's first end-to-end silicon carbide (SiC) semiconductor production plant. The plant involves an investment of approximately Rs 2,000 crore. Slated to be fully...

READ MORE