SiCSem, a power electronics chip company, performed the groundbreaking ceremony in Bhubaneswar on Saturday for setting up India’s first end-to-end silicon carbide (SiC) semiconductor production plant. The plant involves an investment of approximately Rs 2,000 crore.
Slated to be fully operational by 2027–28, the integrated facility is projected to have a processing capacity of 60,000 SiC wafers annually and handle the packaging of about 9.6 crore units.
Union IT and Electronics Minister Ashwini Vaishnaw, on the occasion through a video message, said, “Our dream of bringing advanced technology to Odisha is coming true today, and our special focus is on enabling a seamless integration of industry and academia.
“In this regard, we are partnering with IIT Bhubaneswar for a semiconductor research lab. I recently had the honour of approving Rs 4.95 crore from the MPLAD for establishing the NaMo Semiconductor Lab,” Vaishnaw added.
ଭାରତୀୟ ସେମିକଣ୍ଡକ୍ଟର ମିଶନ୍ (ISM) ଅନୁମୋଦିତ ଏହି କମ୍ପାଉଣ୍ଡ୍ ସେମିକଣ୍ଡକ୍ଟର ଫ୍ୟାବ୍ରିକେସନ୍ ପ୍ରକଳ୍ପ ₹୨,୦୬୭ କୋଟି ବିନିଯୋଗରେ ସ୍ଥାପିତ ହେବ। ଏହା ଦ୍ୱାରା ପ୍ରାୟ ୫,୦୦୦ ପ୍ରତ୍ୟକ୍ଷ ଓ ପରୋକ୍ଷ ନିଯୁକ୍ତି ସୁଯୋଗ ତିଆରି ହେବ। ଏହାର ବାର୍ଷିକ କ୍ଷମତା ୬୦,୦୦୦ଟି ୱେଫର୍ ଉତ୍ପାଦନ ଏବଂ ୯ କୋଟି ୬୦ ଲକ୍ଷ ୟୁନିଟ୍ର ପ୍ୟାକେଜିଂ… pic.twitter.com/W0f9rQ0knV
— Mohan Charan Majhi (@MohanMOdisha) November 1, 2025
Silicon carbide chips are essential components for high-voltage applications in critical products such as electric vehicles (EVs), power inverters, and renewable energy systems.
The union minister said under the leadership of Prime Minister Narendra Modi, electronics industries have grown six times in the last 11 years and India’s electronics export increased eight times in 12 years.
“We are now third largest exporter of electronic items in the world… I urge the state government to take up semiconductor industries aggressively,” he appealed.
“The Centre will support Odisha in all matters. We can together make reforms and policy for the development of the sector. Odisha should make a Data Centre policy as all major industries across the world are now interested to have their Data Centre in India,” Vaishnaw said.
The event was attended by Odisha Chief Minister Mohan Charan Majhi and the state’s Electronics and IT Minister Mukesh Mahaling, alongside several senior officials representing the state government.
Guru Thalapaneni, Managing Director of SiCSem Pvt Ltd, stated the new integrated facility will be capable of processing 60,000 SiC wafers annually and packaging approximately 9.6 crore units.
SiCSem, which operates as a subsidiary of Archean Chemical Industries, had its proposal for establishing the silicon carbide chip project officially approved by the cabinet on August 12.
