Chief Minister Mohan Charan Majhi, on Wednesday, announced that Odisha government has signed Memorandums of Understanding (MoUs) worth Rs 2,655 crore on the first day of SEMICON India 2025.
The state government signed the MoUs with major firm for setting up their semiconductor units in the state at the conclave in New Delhi.
“I had the privilege to inaugurate the Odisha Pavilion, where we signed MoUs worth 2,655 crore with TopTrack Hi-Tech PCB Pvt Ltd (Rs 1,005 crore) and @SancodeTech in technological partnership with Silicon Connect, Inari Amertron Berhad & APIRC Penang (Rs 1,650 crore), while engaging with global majors like Intel, Micron, Western Digital, Renesas, and Siemens,” CM Majhi said in a post on X on Wednesday.
Stating that Odisha showcased its vision to emerge as the next powerhouse in India in semiconductors and advanced electronics at the conclave in New Delhi, the CM said that these engagements with big names in the sector were a decisive step in positioning the state as a preferred global destination for the semiconductor and advanced electronics industry.
“With landmark projects under the India Semiconductor Mission, along with the Odisha Semiconductor Manufacturing & Fabless Policy 2025 and the Electronics Component Manufacturing (ECM) Policy 2025, we are committed to building a world-class ecosystem for innovation, manufacturing, and investment in semiconductors and electronics,” Majhi said.
#Odisha showcased its vision to emerge as India’s next powerhouse in semiconductors and advanced electronics at #SEMICONIndia2025, New Delhi. I had the privilege to inaugurate the Odisha Pavilion, where we signed MoUs worth ₹2,655 crore with TopTrack Hi-Tech PCB Pvt. Ltd.… pic.twitter.com/2LNvHWXzva
— Mohan Charan Majhi (@MohanMOdisha) September 3, 2025
President and CEO of SEMI Ajit Manocha praised Odisha’s semiconductor policies and invited the Chief Minister to Semicon Japan later this year, reports said.
The chief minister met the leadership of @SIcsemHQ at the conclave. “With groundbreaking of their plant in Odisha expected during mid-October 2025 – a big leap toward strengthening India’s chip manufacturing ecosystem,” Odisha Electronics & Information Technology (EIT) department said in a post on X.
“Majhi also met the leadership of @RIR_Power at #SemiconIndia2025. Their clean room will be ready by Sep 2025 with SiC wafer fabrication launching Dec 2025 in #Odisha. RIR’s Taiwan tie-up delivers 6′ SiC wafers; packaging dry run set for March 2026!”, the department said.
Majhi also met @RenesasGlobal delegation led by Malini Narayanamoorthi. Renesas is keen to form JVs as technology partner and tie-up with @IITBhubaneswar for embedded design training. Bringing the Renesas-C2S MoU benefits to Odisha Youth, it said.
Hon’ble CM Shri Mohan Charan Majhi met the leadership of @SIcsemHQ at #SemiconIndia2025! With groundbreaking of their plant in Odisha expected during mid-October 2025 – —a big leap toward strengthening India’s chip manufacturing ecosystem pic.twitter.com/xoJKzbAfj9
— EIT Odisha (@EITOdisha) September 3, 2025
“MoU signed with @SancodeTech in technological partnership with Silicon Connect, Inari Amertron Berhad & APIRC Penang! Plans include a high-value skilling centre for Odisha’s youth and exploring G2G collaboration with Malaysia. Major step towards VLSI & packaging excellence,” the department said in a post on X.
The state’s Electronics & Information Technology (E&IT) Department is participating in SEMICON India 2025, being held from September 2 to 4 at Yashobhoomi in New Delhi, through a dedicated Odisha Pavilion.
CM Majhi inaugurated the Odisha Pavilion at SEMICON India 2025. “With bold policies, next-gen infrastructure & investment ready opportunities, Odisha is gearing up to be the next big hub for semiconductor & electronics innovation,” said the department in a post on X.
